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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/01/2022
Application #:
17178157
Filing Dt:
02/17/2021
Publication #:
Pub Dt:
06/30/2022
Inventors:
Ajay Kumar Sharma, Rishi Bhooshan, Sumit Varshney, Frank Martin Paglia
Title:
SYSTEM AND METHOD FOR REDUCING MUTUAL COUPLING FOR NOISE REDUCTION IN SEMICONDUCTOR DEVICE PACKAGING
Assignment: 1
Reel/Frame:
055758/0001Recorded: 03/29/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/28/2021
Exec Dt:
03/27/2021
Exec Dt:
03/27/2021
Exec Dt:
03/24/2021
Assignee:
HIGH TECH CAMPUS 60
NL-5656 AG
EINDHOVEN, NETHERLANDS NL-5656 AG
Correspondent:
TERRILE, CANNATTI & CHAMBERS, LLP
11675 JOLLYVILLE ROAD
SUITE 100
AUSTIN, TX 78754

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