Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17556906
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Filing Dt:
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12/20/2021
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Publication #:
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Pub Dt:
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06/30/2022
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Inventors:
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Joo-Il HA, Yeong-Been KIM, Jae-Hwan KIM, Dong-Min NOH, Woo-Pil SHIM
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Title:
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SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2374-36, JUNGBUDAE-RO, YANGJI-MYEON, CHEOIN-GU |
YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 17162 |
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PARK, KIM & SUH, LLC |
1999 AVENUE OF THE STARS |
SUITE 1100 |
CENTURY CITY, CA 90067 |
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09/20/2024 04:14 AM
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