Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/12/2023
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Application #:
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17703088
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Filing Dt:
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03/24/2022
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Publication #:
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Pub Dt:
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07/07/2022
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Inventors:
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Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen et al
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Title:
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BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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ESCHWEILER & POTASHNIK, LLC |
629 EUCLID AVE. |
SUITE 1101 |
CLEVELAND, OH 44114 |
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05/14/2024 11:33 PM
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