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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/27/2023
Application #:
17712234
Filing Dt:
04/04/2022
Publication #:
Pub Dt:
07/14/2022
Inventors:
Shuen-Shin Liang, Chen-Han Wang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen
Title:
SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
061690/0945Recorded: 11/08/2022Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/25/2021
Exec Dt:
04/25/2021
Exec Dt:
04/25/2021
Exec Dt:
05/05/2021
Exec Dt:
04/28/2021
Assignee:
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C
1100 NEW YORK AVENUE, N.W.
WASHINGTON, DC 20005

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