Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/18/2022
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Application #:
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17149151
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Filing Dt:
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01/14/2021
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Publication #:
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Pub Dt:
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07/14/2022
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Inventors:
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Yueh-Chang WU, Yi-Chieh CHEN, Te-Chuan WANG, Tzu-Hsuan HSU
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Title:
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SYSTEMS FOR COOLING ELECTRONIC COMPONENTS IN A SEALED COMPUTER CHASSIS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 188, WENHUA 2ND RD., GUEISHAN DIST. |
| TAOYUAN CITY, TAIWAN 33383 |
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| NIXON PEABODY LLP |
| 70 W. MADISON STREET |
| SUITE 3500 |
| CHICAGO, IL 60602 |
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