Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/16/2024
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Application #:
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17605002
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Filing Dt:
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10/20/2021
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Publication #:
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Pub Dt:
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07/21/2022
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Inventors:
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Shuichi HIZA, Kunihiko NISHIMURA, Masahiro FUJIKAWA, Yuki TAKIGUCHI, Eiji YAGYU
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Title:
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Method for manufacturing a semiconductor substrate and device by bonding an epitaxial substrate to a first support substrate, forming a first and second protective thin film layer, and exposing and bonding a nitride semiconductor layer to a second support substrate
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7-3, MARUNOUCHI 2-CHOME, |
CHIYODA-KU, |
TOKYO, JAPAN 1008310 |
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XSENSUS LLP |
100 DAINGERFIELD ROAD |
SUITE 402 |
ALEXANDRIA, VA 22314 |
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05/02/2024 05:50 PM
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