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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	17616218	Filing Dt:	12/03/2021
Publication #:	20220234160	Pub Dt:	07/28/2022
Inventors:	Yohei YAMAWAKI, Seiji NAKANO, Yoshihiro KAWAGUCHI, Munehisa KODAMA
Title:	SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Assignment: 1

Reel/Frame:

058277/0560

Recorded: 12/03/2021

Pages: 14

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

YAMAWAKI, YOHEI

Exec Dt:

11/10/2021

KAWAGUCHI, YOSHIHIRO

Exec Dt:

11/10/2021

KODAMA, MUNEHISA

Exec Dt:

11/11/2021

NAKANO, SEIJI

Exec Dt:

11/10/2021

Assignee:

TOKYO ELECTRON LIMITED

3-1, AKASAKA 5-CHOME, MINATO-KU

TOKYO, JAPAN 107-6325

Correspondent:

BRUNDIDGE & STANGER, P.C.

1925 BALLENGER AVENUE, SUITE 560

ALEXANDRIA, VA 22314

Assignment: 2

Reel/Frame:

058342/0011

Recorded: 12/07/2021

Pages: 16

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE INVENTOR SEIJI NAKANO AS THE SECOND INVENTOR PREVIOUSLY RECORDED AT REEL: 058277 FRAME: 0560. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

YAMAWAKI, YOHEI

Exec Dt:

11/10/2021