Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17708386
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Filing Dt:
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03/30/2022
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Publication #:
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Pub Dt:
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07/28/2022
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Inventors:
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Narasimha Lanka, Lakshmipriya Seshan, Debendra Das Sharma, Swadesh Choudhary, Zuoguo Wu et al
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Title:
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LINK INITIALIZATION TRAINING AND BRING UP FOR DIE-TO-DIE INTERCONNECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| MARK J. ROZMAN |
| PO BOX 41790 |
| HOUSTON, TX 77241-1790 |
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