Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/13/2024
|
Application #:
|
17722529
|
Filing Dt:
|
04/18/2022
|
|
Publication #:
|
|
Pub Dt:
|
07/28/2022
| | | | |
|
Inventors:
|
Daisuke SAKUMOTO, Masami JUTA
|
|
Title:
|
INSULATING COMPONENT, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR APPARATUS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 6, TAKEDA TOBADONO-CHO |
| FUSHIMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 612-8501 |
|
|
|
|
| VOLPE KOENIG |
| 30 SOUTH 17TH STREET, 18TH FLOOR |
| PHILADELPHIA, PA 19103 |
|
|
Search Results as of:
04/27/2024 03:30 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
