Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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05/21/2024
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Application #:
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17186742
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Filing Dt:
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02/26/2021
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Publication #:
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Pub Dt:
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07/28/2022
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Inventors:
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Chen-Yu Tsai, Ku-Feng Yang, Wen-Chih Chiou
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Title:
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Bonding Structures of Integrated Circuit Devices and Method Forming the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
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05/16/2024 04:09 PM
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