Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17721379
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Filing Dt:
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04/15/2022
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Publication #:
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Pub Dt:
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07/28/2022
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Inventor:
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Takashi TSUTSUI
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Title:
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SEMICONDUCTOR PACKAGE AND THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT USING LIQUID IMMERSION COOLING SYSTEM BY PERFORATED INTERPOZER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-7-1 KAIGAN |
| MINATO-KU |
| TOKYO, JAPAN 105-7529 |
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| RYUKA USA LLP |
| JP CALIMAN, 3 CORPORATE PARK |
| SUITE 250 |
| IRVINE, CA 92606 |
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