Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17726172
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Filing Dt:
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04/21/2022
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Publication #:
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Pub Dt:
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08/04/2022
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Inventor:
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Hideyasu TAKATSUJI
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Title:
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RESIN MOLDED COMPONENT, BATTERY PACK, AND INSPECTION METHOD FOR RESIN MOLDED COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI |
| KYOTO, JAPAN 617-8555 |
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| K&L GATES |
| P.O. BOX 1135 |
| CHICAGO, IL 60690-1135 |
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