Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17615136
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Filing Dt:
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11/30/2021
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Publication #:
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Pub Dt:
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08/04/2022
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Inventors:
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Thomas L. Koch, Erfan M. Fard, Roland Himmelhuber, Linan Jiang, Stanley K.H. Pau et al
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Title:
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CHIP-TO-CHIP OPTICAL INTERCONNECTION USING HIGH REFRACTIVE INDEX COUPLERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| THE UNIVERSITY OF ARIZONA, TECH LAUNCH ARIZONA, UNIVERSITY SERVICES ANNEX, 4TH FLOOR, P.O. BOX 210300A |
| TUCSON, ARIZONA 85721 |
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| MAYER & WILLIAMS PC |
| 55 MADISON AVENUE |
| SUITE 400 |
| MORRISTOWN, NJ 07960 |
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