Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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17612445
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Filing Dt:
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11/18/2021
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Publication #:
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Pub Dt:
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08/04/2022
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Inventors:
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Jun MIZUNO, Hiroyuki KUWAE, Kosuke YAMADA, Masami AIHARA, Takayuki OGAWA
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Title:
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BONDING METHOD AND STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 104 TOTSUKAMACHI 1-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN 1698050 |
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| 671-4, MIZUASHI, NOGUCHI-CHO, KAKOGAWA-SHI |
| HYOGO, JAPAN 6750019 |
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| GREENBLUM & BERNSTEIN, P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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