Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17626444
|
Filing Dt:
|
01/11/2022
|
|
Publication #:
|
|
Pub Dt:
|
08/04/2022
| | | | |
|
Inventors:
|
HIKARU OHIRA, YIOCHIRO FUJINAGA, NINAO SATO, ATSUSHI TSUKADA
|
|
Title:
|
SEMICONDUCTOR PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 4-14-1 ASAHI-CHO |
| ATSUGI-SHI |
| KANAGAWA, JAPAN 2430014 |
|
|
|
|
| CHIP LAW GROUP |
| 505 N LAKESHORE DR |
| SUITE 250 |
| CHICAGO, IL 60611 |
|
|
Search Results as of:
05/15/2024 01:12 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
