Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/07/2023
|
Application #:
|
17729429
|
Filing Dt:
|
04/26/2022
|
|
Publication #:
|
|
Pub Dt:
|
08/11/2022
| | | | |
|
Inventors:
|
Hsin-Yen Huang, Hai-Ching Chen, Shao-Kuan Lee, Chi-Lin Teng, Shau-Lin Shue et al
|
|
Title:
|
DIELECTRIC CAPPING STRUCTURE OVERLYING A CONDUCTIVE STRUCTURE TO INCREASE STABILITY
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| ESCHWEILER & POTASHNIK, LLC |
| 629 EUCLID AVE. |
| SUITE 1101 |
| CLEVELAND, OH 44114 |
|
|
Search Results as of:
05/25/2024 08:28 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
