Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17652580
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Filing Dt:
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02/25/2022
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Publication #:
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Pub Dt:
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08/11/2022
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Inventors:
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Mikael Tuominen, Nick Xin, Seok Kim Tay
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Title:
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Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 5000 JIN DU ROAD |
SHANGHAI, CHINA 201108 |
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SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
1600 PARKWOOD CIRCLE, SUITE 620 |
ATLANTA, GA 30339 |
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