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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/04/2023
Application #:
17177703
Filing Dt:
02/17/2021
Publication #:
Pub Dt:
08/18/2022
Inventors:
Oliver Markus Kreiter, Ludwig Busch, Angel Enverga, Mei Fen Hiew, Tian See Hoe et al
Title:
MOLDED SEMICONDUCTOR MODULE HAVING A MOLD STEP FOR INCREASING CREEPAGE DISTANCE
Assignment: 1
Reel/Frame:
058536/0765Recorded: 01/04/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/26/2021
Exec Dt:
02/18/2021
Exec Dt:
03/03/2021
Exec Dt:
02/17/2021
Exec Dt:
02/24/2021
Exec Dt:
02/17/2021
Exec Dt:
02/26/2021
Exec Dt:
03/09/2021
Exec Dt:
02/18/2021
Exec Dt:
02/24/2021
Exec Dt:
03/08/2021
Exec Dt:
02/17/2021
Exec Dt:
03/08/2021
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959

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