Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17627288
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Filing Dt:
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01/14/2022
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Publication #:
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Pub Dt:
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08/18/2022
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Inventors:
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HIROYUKI SHIGETA, KOHYOH HOSOKAWA, JO UMEZAWA, MASAKI HATANO, HIROFUMI MAKINO et al
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Title:
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SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-14-1 ASAHI-CHO |
| ATSUGI-SHI |
| KANAGAWA, JAPAN 2430014 |
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| CHIP LAW GROUP |
| 505 N LAKESHORE DR |
| SUITE 250 |
| CHICAGO, IL 60611 |
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