Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17680308
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Filing Dt:
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02/25/2022
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Publication #:
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Pub Dt:
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08/25/2022
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Inventors:
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Kunakorn Kaoson, Sukhontip Jaikongkaew, Nataporn Charusabha, Saravuth Sirinorakul et al
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Title:
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FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE MECHANICAL STABILITY AND HEAT DISSIPATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE LTD |
| 7500A BEACH ROAD |
| #04-306/308 THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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