Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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17181380
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Filing Dt:
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02/22/2021
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Publication #:
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Pub Dt:
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08/25/2022
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Inventors:
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Kuo-Ming WU, Ming-Che LEE, Hau-Yi HSIAO, Cheng-Hsien CHOU, Sheng-Chau CHEN et al
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Title:
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PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS OF USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN 6 ROAD |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN ROC 30077 |
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THE MARBURY LAW GROUP, PLLC |
11800 SUNRISE VALLEY DRIVE |
15TH FLOOR |
RESTON, VA 20191 |
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