Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/12/2023
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Application #:
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17663072
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Filing Dt:
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05/12/2022
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Publication #:
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Pub Dt:
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09/01/2022
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Inventors:
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Ashley J.M. ERICKSON, Matthew J. TRAVERSO, Sandeep RAZDAN, Joyce J. M. PETERNEL et al
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Title:
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THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 170 WEST TASMAN DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| PATTERSON & SHERIDAN, LLP/CISC |
| 24 GREENWAY PLAZA - SUITE 1600 |
| HOUSTON, TX 77046-2472 |
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