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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11587900
Issue Dt:
02/21/2023
Application #:
17185970
Filing Dt:
02/26/2021
Publication #:
20220278067
Pub Dt:
09/01/2022
Inventors:
Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh et al
Title:
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
Assignment: 1
Reel/Frame:
055775/0150Recorded: 03/30/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TSENG, HUA-WEI
Exec Dt:
03/02/2021
LIN, YUEH-TING
Exec Dt:
03/01/2021
CHEN, SHAO-YUN
Exec Dt:
03/02/2021
HUANG, LI-HSIEN
Exec Dt:
03/02/2021
SU, AN-JHIH
Exec Dt:
03/01/2021
YEH, MING-SHIH
Exec Dt:
03/01/2021
YEH, DER-CHYANG
Exec Dt:
03/08/2021
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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