Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/01/2023
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Application #:
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17186984
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Filing Dt:
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02/26/2021
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Publication #:
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Pub Dt:
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09/01/2022
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Inventors:
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Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh
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Title:
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Wafer on Wafer Bonding Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP/TSMC |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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05/21/2024 05:49 PM
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