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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17453504
Filing Dt:
11/04/2021
Publication #:
Pub Dt:
09/08/2022
Inventors:
Sangjun PARK, Byungkyu KIM, Sungdong CHO, Eunji KIM, Seungwoo PAEK
Title:
SEMICONDUCTOR CHIP STRUCTURE
Assignment: 1
Reel/Frame:
058016/0554Recorded: 11/04/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/13/2021
Exec Dt:
09/13/2021
Exec Dt:
09/13/2021
Exec Dt:
09/13/2021
Exec Dt:
09/13/2021
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
F. CHAU & ASSOCIATES, LLC
130 WOODBURY ROAD
WOODBURY, NY 11797

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