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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/08/2023
Application #:
17333300
Filing Dt:
05/28/2021
Publication #:
Pub Dt:
09/08/2022
Inventors:
Feng-Cheng Yang, Yu-Wei Jiang, Hung-Chang Sun, Tsu Ching Yang, Sheng-Chih Lai et al
Title:
HIGH SELECTIVITY ISOLATION STRUCTURE FOR IMPROVING EFFECTIVENESS OF 3D MEMORY FABRICATION
Assignment: 1
Reel/Frame:
056640/0557Recorded: 06/23/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/2021
Exec Dt:
06/07/2021
Exec Dt:
05/31/2021
Exec Dt:
05/30/2021
Exec Dt:
05/30/2021
Exec Dt:
05/31/2021
Exec Dt:
05/30/2021
Exec Dt:
05/30/2021
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
ESCHWEILER & POTASHNIK, LLC
ROSETTA CENTER
629 EUCLID AVE., SUITE 1101
CLEVELAND, OH 44114

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