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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/19/2023
Application #:
17829619
Filing Dt:
06/01/2022
Publication #:
Pub Dt:
09/15/2022
Inventors:
Feng QIN, Kerui XI, Tingting CUI, Jie ZHANG, Xuhui PENG
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
060068/0139Recorded: 06/01/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/25/2022
Exec Dt:
05/25/2022
Exec Dt:
05/25/2022
Exec Dt:
05/25/2022
Exec Dt:
05/25/2022
Assignees:
889 HUIQING RD., PUDONG NEW DISTRICT
SHANGHAI, CHINA 201201
3388TH HUANING RD, MINHANG DISTRICT
SHANGHAI, CHINA 201108
Correspondent:
KDB FIRM PLLC (BOIP)
2601 WESTON PARKWAY
SUITE 103
CARY, 27513 UNITED STATES

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