Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17826464
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Filing Dt:
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05/27/2022
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Publication #:
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Pub Dt:
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09/15/2022
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Inventors:
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Maki YONETSU, Seiichi SUENAGA, Sachiko FUJISAWA, Takashi SANO
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Title:
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BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING BONDED BODY, AND METHOD FOR MANUFACTURING CERAMIC COPPER CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| 8, SHINSUGITA-CHO, ISOGO-KU, KANAGAWA |
| YOKOHAMA-SHI, JAPAN |
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| OBLON, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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