Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17639544
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Filing Dt:
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03/01/2022
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Publication #:
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Pub Dt:
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09/22/2022
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Inventor:
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Tetsuro NISHIMURA
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Title:
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SOLDER PASTE AND SOLDER BONDED BODY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-16-15, ESAKACHO, SUITA-SHI |
| OSAKA, JAPAN 5640063 |
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| FITCH, EVEN, TABIN & FLANNERY LLP |
| 120 S LASALLE STREET |
| SUITE 2100 |
| CHICAGO, IL 60603-3406 |
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05/15/2024 05:44 PM
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