Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17695022
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Filing Dt:
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03/15/2022
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Publication #:
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Pub Dt:
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09/22/2022
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Inventors:
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Young Gi LEE, Hyun Woo LEE, Jong Won LEE, Ji Ho LEE, Soo Yeon SIM, Chang Suk LEE
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Title:
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CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD OF POLISHING TUNGSTEN PATTERN WAFER USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 150-20, GONGSE-RO, GIHEUNG-GU |
| YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 17084 |
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| EUGENE M LEE |
| LEE IP LAW, P.C. |
| 3141 FAIRVIEW PARK DRIVE, SUITE 500 |
| FALLS CHURCH, VA 22042 |
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