Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17753215
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Filing Dt:
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02/24/2022
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Publication #:
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Pub Dt:
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09/22/2022
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Inventors:
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Hoshiaki TERAO, Kouichi HASHIMOTO, Raita WADA
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Title:
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HEAT SINK, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, KAMIOSE-CHO, HIGASHI-KU, |
| NIIGATA-SHI, NIIGATA, JAPAN 9500063 |
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| 2-3, UCHISAIWAI-CHO 2-CHOME, |
| CHIYODA-KU, TOKYO, JAPAN 1000011 |
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| KENJA IP LAW PC |
| 4 NORTH SECOND STREET, SUITE 598 |
| SAN JOSE, CA 95113 |
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04/27/2024 05:44 PM
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