Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17294645
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Filing Dt:
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05/17/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Inventors:
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Bo Tang, Peng Zhang, Yan Yang, Zhihua Li, Fujun Sun, Bin Li, Wenwu Wang, Ruonan Liu, Kai Huang et al
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Title:
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METHOD FOR PACKAGING SEMICONDUCTOR STRUCTURE HAVING TRENCH, PACKAGING STRUCTURE HAVING SEALED TRENCH, AND CHIP COMPRISING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3 BEITUCHENG WEST ROAD |
| CHAOYANG DISTRICT |
| BEIJING, CHINA 100029 |
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| GOODWIN PROCTER LLP |
| 901 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20001 |
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