Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17215883
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Filing Dt:
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03/29/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Inventors:
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Muhammad H. ALVI, Ming LIU, Rashmi PRASAD, Anthony M. COPPOLA
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Title:
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3-D POWER MODULES WITH DOUBLE SIDED COOLING PER SEMICONDUCTOR DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 300 |
| MAIL CODE 482-C22-A68 |
| DETROIT, MICHIGAN 48265 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| 5445 CORPORATE DRIVE |
| SUITE 200 |
| TROY, MI 48098 |
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