Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17633598
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Filing Dt:
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02/08/2022
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Publication #:
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Pub Dt:
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09/29/2022
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Inventors:
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Daisuke MORI, Masahiro ASAHARA, Katsushi KAN, Eiichi NOMURA
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Title:
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MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD UNDERFILL ENCAPSULATION, ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-17, SHINMACHI 1-CHOME, NISHI-KU, OSAKA-SHI |
| OSAKA, JAPAN 5508668 |
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| IMAIZUMI IP LAW, PLLC |
| 4601 NORTH FAIRFAX DRIVE |
| SUITE 1200 |
| ARLINGTON, VA 22203 |
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