Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17616813
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Filing Dt:
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12/06/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Inventor:
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Motonobu TAKEYA
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Title:
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SEMICONDUCTOR CHIP INTEGRATED DEVICE MANUFACTURING METHOD, SEMICONDUCTOR CHIP INTEGRATED DEVICE, SEMICONDUCTOR CHIP INTEGRATED DEVICE ASSEMBLY, SEMICONDUCTOR CHIP INK, AND SEMICONDUCTOR CHIP INK EJECTION DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 205, ASAHI PLAZA JOZENJIKITA, 11-13 |
| KOKUBUNCHO 3-CHOME, AOBA-KU, SENDAI-SHI |
| MIYAGI, JAPAN 9800803 |
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| K&L GATES |
| P.O. BOX 1135 |
| CHICAGO, IL 60690-1135 |
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