Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/19/2024
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Application #:
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17639151
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Filing Dt:
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02/28/2022
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Publication #:
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Pub Dt:
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10/06/2022
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Inventors:
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Jialin WANG, Shengqiang WU, Yuanhong WEN, Chaoxue QIN, Jia DENG, Rongkun FAN, Xue MENG et al
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Title:
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BONDING METHOD AND BONDING DEVICE FOR FLEXIBLE PANEL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1188 HEZUO RD. (WEST ZONE), |
| HI-TECH DEVELOPMENT ZONE |
| CHENGDU, SICHUAN PROVINCE, CHINA 611731 |
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| NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, |
| BEIJING, CHINA 100015 |
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| WORKMAN NYDEGGER |
| 60 E. SOUTH TEMPLE |
| SUITE 1000 |
| SALT LAKE CITY, UT 84111 |
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