Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17673234
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Filing Dt:
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02/16/2022
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Publication #:
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Pub Dt:
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10/06/2022
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Inventors:
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CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, TRUNG TRI DOAN, DAVID TRUNG DOAN et al
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Title:
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Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F, NO. 11, KE JUNG RD., CHU-NAN SITE |
| HSINCHU SCIENCE PARK |
| CHU-NAN, MIAO-LI COUNTY, TAIWAN 350 |
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| 20TH FLOOR (RECEPTION),MARUNOUCHI EIRAKU BLDG. |
| 4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-0005 |
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| STEPHEN A. GRATTON |
| 2764 SOUTH BRAUN WAY |
| LAKEWOOD, CO 80228 |
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