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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17708323
Filing Dt:
03/30/2022
Publication #:
Pub Dt:
10/13/2022
Inventors:
Seungmin RYU, Jaewoon KIM, Kazuya SAITO, Yutaro AOKI, Younjoung CHO, Yoshiki MANABE et al
Title:
ORGANOMETALLIC ADDUCT COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
Assignment: 1
Reel/Frame:
059546/0659Recorded: 03/30/2022Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/05/2022
Exec Dt:
02/25/2022
Exec Dt:
02/05/2022
Exec Dt:
01/31/2022
Exec Dt:
02/02/2022
Exec Dt:
02/01/2022
Exec Dt:
01/18/2022
Exec Dt:
02/14/2022
Exec Dt:
02/05/2022
Exec Dt:
02/01/2022
Exec Dt:
01/18/2022
Exec Dt:
02/01/2022
Exec Dt:
02/01/2022
Exec Dt:
02/01/2022
Assignees:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU
TOKYO, JAPAN
Correspondent:
EUGENE M LEE
LEE IP LAW, P.C.
3141 FAIRVIEW PARK DRIVE, SUITE 500
FALLS CHURCH, VA 22042

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