Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17846775
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Filing Dt:
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06/22/2022
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Publication #:
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Pub Dt:
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10/13/2022
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Inventors:
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Akihiro SATO, Shuhei SAIDO, Kenta KASAMATSU
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Title:
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Substrate Processing Apparatus, Heat Insulator Assembly and Method of Manufacturing Semiconductor Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-4, KANDAKAJI-CHO |
| CHIYODA-KU |
| TOKYO, JAPAN 1010045 |
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| EDELL, SHAPIRO & FINNAN, LLC |
| 9801 WASHINGTONIAN BLVD. |
| SUITE 750 |
| GAITHERSBURG, MD 20878 |
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05/09/2024 06:33 AM
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