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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/09/2024
Application #:
17851675
Filing Dt:
06/28/2022
Publication #:
Pub Dt:
10/13/2022
Inventors:
Tetsu OHTOU, Ching-Wei TSAI, Kuan-Lun CHENG, Yasutoshi OKUNO, Jiun-Jia HUANG
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
060421/0752Recorded: 07/01/2022Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/20/2018
Exec Dt:
07/17/2018
Exec Dt:
07/10/2018
Exec Dt:
07/19/2018
Exec Dt:
07/23/2018
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD
SUITE 100E
FALLS CHURCH, VA 22042

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