Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17856765
|
Filing Dt:
|
07/01/2022
|
|
Publication #:
|
|
Pub Dt:
|
10/20/2022
| | | | |
|
Inventors:
|
Weiping Liu, Ning-Cheng Lee
|
|
Title:
|
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELECTRONICS APPLICATIONS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 34 ROBINSON ROAD |
| CLINTON, NEW YORK 13323 |
|
|
|
|
| SHEPPARD, MULLIN, RICHTER & HAMPTON LLP |
| 650 TOWN CENTER DRIVE, 4TH FLOOR |
| COSTA MESA, CA 92626 |
|
|
Search Results as of:
05/15/2024 01:46 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
