Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17473964
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Filing Dt:
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09/13/2021
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Publication #:
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Pub Dt:
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10/20/2022
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Inventors:
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Tung-Han CHUANG, Hsing-Hua TSAI
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Title:
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DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F, NO. 9, LIXING 5TH RD., EAST DIST. |
| HSINCHU CITY, TAIWAN 300 |
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| NELSON QUINTERO |
| 615 HAMPTON DRIVE SUITE A202 |
| VENICE, CA 90291 |
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