Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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17232734
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Filing Dt:
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04/16/2021
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Publication #:
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Pub Dt:
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10/20/2022
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Inventors:
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Meng-Han Lin, Chia-En Huang
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Title:
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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN 6 ROAD |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| FOLEY & LARDNER LLP |
| 500 WOODWARD AVENUE |
| SUITE 2700 |
| DETROIT, MI 48226 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE DELL WAY |
| ROUND ROCK, TEXAS 78682 |
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| BAKER BOTTS L.L.P. |
| 98 SAN JACINTO BLVD |
| SUITE 1500 |
| AUSTIN, TX 78701 |
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