Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17339796
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Filing Dt:
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06/04/2021
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Publication #:
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Pub Dt:
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11/03/2022
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Inventors:
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Sheng-Chieh TSAI, Yao-Zong CHEN, Yu-Yang CHANG, Hsiou-Ming LIU
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Title:
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TRANSPARENT CONDUCTIVE SUBSTRATE STRUCTURE USED FOR THERMOFORMING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1-1, LN. 28, GAOQING RD., YANGMEI DIST., |
| TAOYUAN CITY, TAIWAN 326 |
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| HDLS IPR SERVICES |
| P.O. BOX 230970 |
| CENTREVILLE, VA 20120 |
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