Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17430754
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Filing Dt:
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08/13/2021
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Publication #:
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Pub Dt:
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11/03/2022
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Inventors:
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Yangang WANG, Haihui LUO, Guoyou LIU
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Title:
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HIGH POWER DENSITY 3D SEMICONDUCTOR MODULE PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DODDINGTON ROAD |
| LINCOLN |
| LINCOLNSHIRE, UNITED KINGDOM LN6 3LF |
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| TIANXIN BUSINESS PARK |
| ROOM 309 SHIFENG DISTRICT |
| ZHUZHOU, CHINA |
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| CRAIG W. HAYDEN |
| 1300 EAST 9TH STREET |
| SUITE 1700 |
| CLEVELAND, OH 44114 |
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