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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17770142
Filing Dt:
04/19/2022
Publication #:
Pub Dt:
11/10/2022
Inventors:
Shunsaku YOSHIKAWA, Takashi SAITO, Yuuki IIJIMA, Kanta DEI, Takahiro MATSUFUJI
Title:
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, IN-VEHICLE ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, IN-VEHICLE ELECTRONIC CIRCUIT DEVICE AND ECU ELECTRONIC CIRCUIT DEVICE
Assignment: 1
Reel/Frame:
059725/0848Recorded: 04/19/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/07/2022
Exec Dt:
01/07/2022
Exec Dt:
01/07/2022
Exec Dt:
01/07/2022
Exec Dt:
01/07/2022
Assignee:
23, SENJU-HASHIDO-CHO, ADACHI-KU
TOKYO, JAPAN 1208555
Correspondent:
WENDEROTH, LIND & PONACK L.L.P
1025 CONNECTICUT AVENUE NW
SUITE 500
WASHINGTON, DC 20036

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