Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/07/2023
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Application #:
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17308176
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Filing Dt:
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05/05/2021
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Publication #:
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Pub Dt:
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11/10/2022
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Inventors:
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RISA MIYAZAWA, Takahito Watanabe, Hiroyuki Mori
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Title:
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FABRICATING AN INTERCONNECTION USING A SACRIFICIAL LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION PATENT CENTER |
| 1701 NORTH STREET |
| B/256-3 |
| ENDICOTT, NY 13760 |
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05/10/2024 01:19 PM
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