Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17737564
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Filing Dt:
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05/05/2022
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Publication #:
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Pub Dt:
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11/10/2022
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Inventors:
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Ramesh KOTHANDAPANI, Christopher Johnson, ZhenWei Tee, Noel De Leon, SinLi Tan
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Title:
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MICROELECTRONICS PACKAGE ASSEMBLIES AND PROCESSES FOR MAKING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6070 PARKLAND BOULEVARD |
MAYFIELD HEIGHTS, OHIO 44124 |
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COZEN O'CONNOR |
1200 19TH STREET NW, 3RD FLOOR |
WASHINGTON, DC 20036 |
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05/28/2024 03:43 AM
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