Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/01/2023
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Application #:
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17313474
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Filing Dt:
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05/06/2021
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Publication #:
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Pub Dt:
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11/10/2022
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Inventors:
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Wei-Ren CHEN, Cheng-Yu LIN, Hui-Zhong ZHUANG, Yung-Chen CHIEN, Jerry Chang Jui KAO et al
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Title:
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INTEGRATED CIRCUIT DEVICE AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAUPTMAN HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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