Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17731868
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Filing Dt:
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04/28/2022
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Publication #:
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Pub Dt:
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11/17/2022
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Inventors:
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Samuel Jiang, Yichen Shen, Shanshan Yu
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Title:
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THREE-DIMENTIONAL PACKAGING METHOD AND PACKAGE STRUCTURE OF PHOTONIC-ELECTRONIC CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 1001, 10TH FLOOR, BUILDING 6 |
| FINANCIAL CITY, CANGQIAN STREET, YUHANG DISTRICT |
| HANGZHOU, CHINA |
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| CHRISTOPHER L. REILLY |
| FISH & RICHARDSON P.C. |
| P.O.BOX 1022 |
| MINNEAPOLIS, MN 55440-1022 |
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