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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/17/2023
Application #:
17731868
Filing Dt:
04/28/2022
Publication #:
Pub Dt:
11/17/2022
Inventors:
Samuel Jiang, Yichen Shen, Shanshan Yu
Title:
THREE-DIMENTIONAL PACKAGING METHOD AND PACKAGE STRUCTURE OF PHOTONIC-ELECTRONIC CHIP
Assignment: 1
Reel/Frame:
064677/0627Recorded: 08/23/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/21/2023
Assignee:
ROOM 1001, 10TH FLOOR, BUILDING 6
FINANCIAL CITY, CANGQIAN STREET, YUHANG DISTRICT
HANGZHOU, CHINA
Correspondent:
CHRISTOPHER L. REILLY
FISH & RICHARDSON P.C.
P.O.BOX 1022
MINNEAPOLIS, MN 55440-1022

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